Electronic Design Automation
Friday, September 27, 2024 at the Texas A&M – Fort Worth Campus
Registration now closed.
Mark your calendars for the Advanced Packaging Co-Design/EDA Technical Symposium on Friday, September 27, 2024, at the Texas A&M Fort Worth Campus! This exciting one-day event is your chance to connect with industry leaders, academics, and innovators as we explore the forefront of semiconductor packaging and electronic design automation (EDA).
What to Expect: The symposium will kick off at 8:00 AM where you’ll have the opportunity to network over light refreshments. Following the welcome address by Dr. Steve Putna, Director of the Texas A&M Semiconductor Institute, get ready for a packed agenda featuring dynamic panel discussions and interactive breakout sessions designed to spark collaboration and inspire innovation.
Don’t miss this chance to engage with fellow professionals, gain new perspectives, and contribute to the future of advanced packaging and EDA. Review the symposium agenda for more details.
Register Now! Ensure your spot at this pivotal event and be part of the conversation that shapes the future of semiconductor technology. We look forward to seeing you there!